摘要
介绍了塑封器件的优缺点以及发展情况,针对塑封半导体器件本身在材料、结构和工艺等方面的特点,对塑封器件的失效模式和在试验中暴露的问题进行探讨,针对塑封器件的温度适应性、密封性、工艺控制及使用长期可靠性方面制定了相应的质量评价方案。半导体塑封器件通过质量评价方案的试验项目,包括筛选试验、可靠性鉴定试验和破坏性物理分析(DPA)三方面的试验,降低了塑封器件在应用中的风险,对我国高可靠领域中对塑封器件的选用具有一定的借鉴意义。
The advantages and disadvantages of plastic encapsulated microcircuits （PEMs） and the development situations were introduced. In view of the characteristics of PEM devices in the aspects of material, structure, process, the failure modes and the problems appeared in the test were discussed. The quality evaluation scheme was established for the temperature adaptability, hermeticity, manufacture process and long term employing reliability of the PEM. The applying risks of the PEM can be reduced by performing proper quality evaluation scheme, including teh screening test, reliability qualification test and destructive physical analysis （DPA）, which is a significant reference for the PEM applying in the high reliability field.
出处
《半导体技术》
CAS
CSCD
北大核心
2014年第4期305-308,314,共5页
Semiconductor Technology
关键词
塑封器件(PEM)
高可靠性
失效模式
评价
方案
plastic encapsulated microcircuit （PEM）
high reliability
failure mode
evalua-tion
scheme
