硅烷偶联剂对Nano-ZnO/PLA复合材料抑菌性能与热降解性的影响

Effect of Silicon Coupling Agent on Properties of Bacteriostasis and Thermal Degradation of Nano-ZnO/PLA Composite

采用硅烷偶联剂KH550对纳米氧化锌(nano-ZnO)进行表面处理,制备nano-ZnO/PLA复合材料,研究KH550和nano-ZnO对PLA材料的力学性能、抑菌性和热稳定性能的影响。用OFW方法分析材料的热降解行为。结果表明:nano-ZnO/PLA复合材料对大肠杆菌有抑菌性能。KH550表面处理提高nano-ZnO的分散性,增强其抑菌作用,改善复合材料的界面相容性,提高力学性能。nano-ZnO降低了PLA的热分解温度和热降解活化能,KH550延缓了这种作用。

Nano-ZnO/PLA composite was prepared with nano-ZnO as fillers whose surfaces were modified by silicon coupling agent KH550. The effects of KH550 and nano-ZnO on the properties of mechanics, bacteriostasis, and thermal stabilities of PLA composite were explored. The thermal degradation behaviors of the composite were analysized by using OFW method. The results indicated that the nano-ZnO/PLA composite played a bactcriostasis role on Escherichia coll. The dispersity and baeteriostasis of nano-ZnO were improved after surface modified by KH550, the interface compatibilities and the mechanical properties of the composite were enhanced as well. The thermal decomposition temperatures and the thermal degradation activation energies of PLA were decreased by nano-ZnO. However,these actions were delayed by KH550.