摘要
由于直流电沉积镍使用极限电流密度小 ,沉积速度低。本文介绍脉冲喷射电沉积的方法制备镍镀层。研究了脉冲频率、占空比、电流密度及糖精对镀层晶粒尺寸的影响。结果表明 :镀层晶粒尺寸随脉冲频率、平均电流密度的增大而减小 ;随占空比的增大而增大。少量糖精的加入能有效降低镀层晶粒尺寸。
In view of the weaknesses of direct current nickel electrodeposition such as low limit current density and deposition rate, method of pulse jet-electrodeposition was adopted to prepare nickel deposit. The effect of pulse frequency, duty ratio, current density and saccharin on grain size of nickel electrodeposits was studied. The results show that grain size of nickel deposits decreases with the increase of pulse frequency and average current density, increases with the increase of duty ratio. In addition, grain size effectively decreases provided that small amount of saccharin was added into the nickel electrolyte.
出处
《电镀与涂饰》
CAS
CSCD
2000年第6期11-13,41,共4页
Electroplating & Finishing
基金
河北省自然科学基金!资助项目 (5 982 5 0 )