摘要
本文论述了无铅焊料的发展,阐释了无铅焊料使用的必然性。对目前正在研究的无铅焊料的物理和力学性能进行了分析,并介绍了目前常用的几种无铅焊料的特性及其应用情况,明确了无铅焊料良好的发展前景。
Discussing the development of lead--free solder and illustrating the necessity of the using of lead--free solder. Analyzing the physical and mechanical properties of the current studying lead--free solder and presenting the properties and applications of several currently used lead--free solder, thus clearing the prospects for the development of lead--free solder.
出处
《中国材料科技与设备》
2013年第6期76-78,86,共4页
Chinese Materials Science Technology & Equipment
基金
大学生创新实践项目(S12055)
关键词
无铅焊料
物理性能
力学性能
应用
Pb--free solders
Physical Properties
Mechanical Properties
Application