摘要
高功率脉冲磁控溅射技术是最新发展起来并受到广泛关注的一种高离化率物理气相沉积技术,它利用较高的脉冲峰值功率(超出传统磁控溅射2~3个数量级)和较低的脉冲占空比(0.5%~10%)来实现高金属离化率(〉50%),在获得优异的膜基结合力、控制涂层微结构、降低涂层内应力、控制涂层相结构等方面都具有显著的技术优势.本文从高功率脉冲磁控溅射技术的原理出发,探讨了高功率脉冲溅射技术沉积涂层的特性和技术优势,介绍了10多年来高功率脉冲磁控溅射技术在刀具涂层界面优化、高性能硬质涂层沉积、复合高功率脉冲磁控溅射技术制备纳米多层/复合硬质涂层和氧化物涂层沉积、低温沉积等方面的研究进展.
High power impulse magnetron sputtering (HIPIMS) is an emerging high-ionization physical vapor deposition technology which was has gained substantial interests. It utilizes pulses of high peak power density (2- 3 orders higher than the conventional magnetron sputtering ) and low duty cycle (0.5%-10%) leading to high ionization of metal atoms. This mode has distinguished advantages during deposition: high adhesive strength, controllable microstructure and phase structure, and decreased resid- ual stress, etc. This review covers the basic principle of HIPIMS, the characteristic of films & coatings deposited by HIPIMS, and the developments of HIPIMS technologies in the recent 10 years: optimization of coating-substrate interface in the coated cutting tools, deposition of high-performance hard coatings, nano-layered/nanocomposite coatings by hybrid HIPIMS, oxide coatings, low-temperature coatings, etc
出处
《广东工业大学学报》
CAS
2013年第4期1-13,133,共13页
Journal of Guangdong University of Technology
基金
国家自然科学基金资助项目(51275095
U1201245)
珠江科技新星项目(2011J2200036)
广东省高等学校珠江学者岗位计划资助项目(2012)
关键词
高功率脉冲磁控溅射技术
离化率
硬质涂层
反应溅射
high power impulse magnetron sputtering
ionization ratio
hard coating
reactive sputtering