摘要
本文研究了化学镀Ni P合金镀液中络合剂对沉积速度的影响 ,结果表明不同络合剂对镀速的影响各不相同 ,本实验研究出的 3 L复合络合剂 ,它的加入使镀液稳定而镀速较高 .
The effect of the complexing agent on plating rate in the plating solution of electroless Ni-P alloy is researched. Results show that different complexing agent result in different effect. Complex complexing agent of 3-L was researched. It can stabilize the plating solution and prompt the plating rate.
出处
《吉林化工学院学报》
CAS
2000年第4期21-23,共3页
Journal of Jilin Institute of Chemical Technology
基金
云南省"省院合作"项目
关键词
化学镀
络合剂
沉积速度
镍磷合金
镀液
electroless plating NiP alloy
!complexing agent
!plating rate
