硅基MEMS制造技术检测方法国际提案介绍

Introduction of International Standard Proposal of Silicon-based MEMS Manufacturing Technology Testing Method

介绍了由我国提出的国际标准提案IEC?62047-25《硅基MEMS制造技术?微键合区剪切和拉压强度检测方法》的重要意义和主要技术内容。该标准对于微米级微小键合区的键合强度测量提供了通用、有效的方法。标准提出了拉压法和剪切法两种测试方法的测试流程。此外还介绍了MEMS理论基础、技术研究基础和国际上MEMS标准化的相关情况。

Introduces the importance and technical contents of the international standard proposal ＂Silicon-based MEMS Production- Shearing and Pull Pressure Strength Testing Method of Micro Bonding Area＂. This standard provides a general and effective method for bonding strength measurement of micron level tiny bonding area. This standard puts forward the testing process of two testing methods-pull pressure method and shearing method. In addition, this paper introduces the theoretical and technical research basis of MEMS, as well as relevant information of MEMS standard technical subcommittee in IEC.