摘要
本文概述了三种不同的固晶方法,对银胶固晶及共晶的芯片进行热阻测量及大电流老化试验,明确了LED共晶方式可以有效降低器件热阻,从而提高封装器件的可靠性。另外,对两种不同共晶方式的成本和工艺问题进行了简要的阐述。
The three different methods of fixing chip were overviewed. By the thermal resistance measurements and the high current aging test, it was clear that the eutectic way could reduce the thermal resistance and improve the reliability of the package device. In addition, the different ways of eutectic cost and process issues were briefly described.
出处
《中国科技信息》
2014年第8期210-211,共2页
China Science and Technology Information
基金
广东省高等学校优秀青年教师培养计划资助(Yq2013193)
广东省自然科学基金(S2012010010030)
深圳市科技计划项目(JCYJ20120615101957810
JCYJ20130401100513002
CXZZ20130322110603202)
