摘要
随着未来手机及数码相机等3G/4G产品的轻、薄、小型化与多功能化发展趋势,线路的精细化程度逐步转向亚微观、微观的微米级尺度,线路的精密要求也大大提高。文章通过典型的三阶三压板的制作过程,从物料选择、设备选择、线路解析度、蚀刻均匀性控制、面铜均匀性控制、线路补偿等方面探讨50μm/50μm精细线路HDI板最佳制作方法,对细线路的制作有一定的参考价值。
As the future of 3G/4G like mobile phones and digital cameras products of light and thin, miniaturization and muti-function change development trend, line level of refinement gradually turned to the microcosmic, microscopic level of micron scale, line also greatly improved the precision requirements. In this article, through the typical third-order three clamp of the production process, from material selection, equipment selection, line resolution, etching uniformity control, uniformity of surface copper control, circuit aspects, etc., it discussed compensation including 50 μm/HDI board including 50 mm ifne lines best method of making, production has a certain reference value for ifne lines.
出处
《印制电路信息》
2014年第4期1-8,共8页
Printed Circuit Information
关键词
精细线路
解析度
蚀刻均匀性
面铜均匀性
动态补偿
Fine Lines
Resolution
Copper Etching Uniformity
Surface Uniformity
Dynamic Compensation
