化学银剥离问题探究及改善

Research and improvement of immersion silver Ag stripping problem

随着电子技术发展,电路板的应用领域不断扩展,由于银的良好导电性能,使得PCB表面处理对化学银越来越受到青睐。文章分析了影响化学银剥离的主要因素,分别从生产药水、设备及铜面粗糙度等方面进行了排查分析,从而得出导致化学银剥离的根本原因,并从工艺上提出了解决方案,建立了预防及改善的措施,降低了缺陷风险。

With the development of electronic technology, the application areas of circuit board is expanding. Immersion Silver Ag is more and more popular in surface treatment of circuit board because of its good conductivity. This paper analyzes the main factors affecting of Immersion Silver Ag stripping, respectively investigation from production of liquid medicine, equipment, and surface roughness of copper, thus the primary cause of Immersion Silver Ag stripping is concluded, and the solution is proposed in the process, therefore, the prevention and improvement measures are established, and the risk of defects are reduced.