摘要
采用不同类型半固化片设计出多种叠层结构,考察其对高速PCB耐热可靠性的影响,发现扁平玻布(1067、2313等)耐热可靠性较差,无法满足客户无铅焊接要求。同时从理论上分析发现,在耐热可靠性测试过程中,扁平玻布半固化片内应力大和浸胶不完全是引起半固化片分层的主要原因。在生产设计过程中,有耐热可靠性要求的板应禁止或减少扁平玻布半固化片的使用。
Some stackups were designed by varies types of fabrics and its’ thermal reliabilities were investigated. It showed that MS fabrics 1067 2113 etc. couldn’t satisfy customers’ lead free requirement due to its’ poor thermal reliabilities. For the further, we analyzed the inner-stress and dimensional change during the thermal reliability tests, and found that high inner-stress and incompletely glue-dip of MS fabric were the main reasons of prepreg delamination. Therefore, MS fabrics should be forbidden or used less in stackup design to meet the thermal reliability requirement.
出处
《印制电路信息》
2014年第4期65-71,共7页
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