pH对化学镀镍-磷法制作的埋嵌电阻方块电阻影响的研究

Study on the effect of pH on the sheet resistance of embedded resistance manufactured by electroless Ni-P method

文章主要介绍了pH对通过化学镀镍-磷法制作埋嵌电阻时镍-磷合金层方块电阻的影响。在温度相同的条件下,当镀液的pH不同时,探究了两种基材表面上镍-磷合金层方块电阻与反应时间的关系,并分析了适合用于制作埋嵌电阻的镍-磷合金层方块电阻值,以及最佳的化学镀镍-磷反应pH值。从实验结果可知,当反应时间相同时,随着pH的减小两种基材表面上镍-磷合金层的方块电阻将会逐渐大;适合用于埋嵌电阻制作的化学镀镍-磷反应pH为3.4~3.7,反应时间为3min^8min,方块电阻为15Ω/□~200Ω/□。

The paper mainly presents the effect of pH on the sheet resistance of Ni-P alloy layer, which produced embedded resistor by Electroless Ni-P method. At the same experimental temperature, when the pH is not the same, the relationship between the sheet resistance of Ni-P alloy layer on the two different substrate surfaces and reaction time is explored;and suitable sheet resistance of Ni-P alloy layer that is used for manufacturing embedded resistance and the optimal pH of Electroless Ni-P reaction are analyzed. From the experimental results, when the reaction time is the same, the sheet resistance of Ni-P alloy layer on the two different substrate surfaces will gradually increase as the pH decreases; the pH of Electroless Ni-P reaction that is suitable for manufacturing embedded resistance was about 3.4~3.7, the reaction time was about 3min^5min, the sheet resistance was about 15Ω/□~200Ω/□.