HDI印制电路板中的激光钻孔工艺研究及应用

The laser drilling of high density interconnect(HDI) technology manufacture and application

文章研究采用CO2激光器研究了HDI印制电路板制作微孔的技术,通过金相显微镜分析了CO2激光器制作的盲孔的锥形度、孔壁角度和孔壁平整性。讨论了激光参数对孔的影响,用优化试验优化参数进,一步确定了真圆度和上下孔径比最优的脉冲能量、脉冲宽度、脉冲次数和光罩尺寸。得到了不同孔径微孔的制作最优工艺参数。

This paper has studied the process and theory of fabricating micro-via using the CO2 lasers on the HDI high density interconnect printed circuit board. Experiment described the process of fabricating micro-via in FR4 substrates using the CO2 laser. Bind via was drilled and evaluated for taper, wall-angle and smoothness through metallurgical microscopy. The effects of the process parameters such as pulse energy, pulse width, the number of pulses and mask dimension were also studied and further optimized. The best process parameters for micro-via with different sizes have been fund.