摘要
化学镀作为一种优良的表面处理技术 ,几乎在所有的工业部门都得到了一定范围的应用。文章首先介绍了化学镀镍层的应用领域 ,然后用正交试验方法优化了 Si C粒子表面化学镀镍工艺 ,测定了 Si C粒子的增重百分率以及镀液的 p H值随时间的变化规律。结果表明 ,Ni2 +的浓度以及其与 H2 PO2 -浓度比值对镀速的影响最大。
As a fine surface technology, electroless plating is applied to almost every industry branch. In this paper, the applications of electroless nickel plating are reviewed,the process of electroless nickel plating on SiCp was optimized with orthogonal experiments, and the relationship between the increasing mass percentage of SiCp, the pH value of the bath and the time was studied. As the results show, the concentration of Ni 2+ and the ratio of [Ni 2+ ]/[H 2PO - 2] have a strong influence on deposition rate.
出处
《合肥工业大学学报（自然科学版）》
CAS
CSCD
2000年第5期667-670,共4页
Journal of Hefei University of Technology：Natural Science
关键词
化学镀镍
工艺
应用
碳化硅
electroless nickel plating
SiCp
process
applications
