电子设备插接件弹出损伤机理分析

Pop-up Damage Mechanism Analysis of the Connector in Electronic Equipment

为了研究电子设备在振动冲击环境中的损伤机理,以电子设备内部插接电路板组件为例,在ANSYS中建立有限元模型,对其在振动冲击环境下的损伤机理进行仿真分析。最后,在冲击试验台上对电子设备进行不同强度的冲击试验。仿真及试验结果表明,当电路板底端受到的力(惯性力)大于摩擦力(插拔力)时,电路板在插接方向出现了明显的位移,进而可判定电路板发生了弹出损伤模式。

In order to study the damage mechanism of the electronic equipment under the vibration and shock environments, the internal plug circuit board assembly of the electronic equipment is taken as an example. The finite element model is established with ANSYS, and its damage mechanism under the vibration and shock environments is simulated and analyzed. At last, the impact test is done on the impact test bench with different intensity levels. Simulation and experimental results show that, when the force （the inertial force） exerted on the bottom of the circuit board is greater than the friction force, the clear displacement of circuit board along the insertion direction is appeared. Thereby the circuit board oeeuring pop-up damage modes is determined.