摘要
介绍了一种集成化单晶硅触觉阵列传感器。该传感器共有 10 0个触觉单元 ,芯片尺寸为 2 5mm×2 5mm ,厚度小于 10mm。在制造工艺上 ,把CMOS工艺和半导体平面工艺融为一体 ,利用MEMS技术在每个触觉单元上制造了触觉受力点 ,易于感受所触物体 ,其测试、记录过程由计算机完成。该种传感器具有一定的开发价值和应用前景。
An integrated monocrystalline silicon tactile-array sensor is introduced,having 100 taticle-units.Chip's dimensions: 25*#mm×25*#mm,thickness is less than 10*#mm.Having been combined with CMOS and simiconductor planar technology and by using MEMS technology, points that are force-sensitive to the objects that they contact are made in each tactile-unit;test and record is completed by computer.
出处
《传感器技术》
CSCD
北大核心
2001年第2期52-53,共2页
Journal of Transducer Technology
