掺杂SnO_2/Cu新型纳米复合材料的制备

Fabrication of doped SnO_2/Cu novel nano-composites

分别采用溶胶-凝胶、粉末冶金工艺制备了TiO2掺杂纳米SnO2粉体、掺杂SnO2/Cu纳米复合材料.采用XRD对纳米SnO2的掺杂效果进行了评估,并分别采用TEM、SEM对掺杂SnO2纳米颗粒及SnO2/Cu纳米复合材料的微观形貌进行了观察,最后对复合材料的硬度与电导率进行了测量.结果表明通过本文所述工艺可成功实现TiO2对纳米SnO2的掺杂,所得掺杂SnO2颗粒为圆球形,粒径约为10nm.掺杂SnO2/Cu纳米复合材料拥有优良的导电性能及显著提高的硬度.随掺杂SnO2含量的增加,复合材料的电导率下降,而硬度增加.复压复烧及冷变形工艺均可明显提高复合材料的硬度与电导率.

SnO2 nano powder doped by TiO2, doped SnOJCu nano-composite were respectively fabricated by sol-gel, powder metallurgy methods, respectively. The doping quality of the nano SnO2 powder was evaluated by XRD technique, and the morphologies of nano SnO2 powder, doped SnOJCu composite were observed by TEM and SEM respectively. Finally, the hardness and electrical conductivity of the composites were tested. The results show that nano SnO2 can be successfully doped by TiO2 using the present method. The resultant doped SnO2 particles are spherical in shape, and about 10 nm in diameter. The doped SnOJCu composites present excellent electrical conductivity and significantly enh- anced hardness. With increasing the content of doped SnO2, the electrical conductivity of the composites decreases, while the hardness increases. Both the repressing, re-sintering process and the cold deformation process can obviously increase the electrical conductivity and the hardness of the composites.