Al_2O_3弥散强化铜与T2铜的真空钎焊工艺研究

Study on Vacuum Brazing of Al_2O_3 Dispersion-strengthen Copper and Copper T2

采用0.1mm Ag-Cu-Ti+0.1mm BAg72Cu和0.1mm Ag-Cu-Ti+0.2mm BAg72Cu两种复合钎料对Al2O3弥散强化铜与T2铜进行真空钎焊,研究钎料配比和保温时间对钎焊接头组织和性能的影响。结果表明,采用厚度为0.2 mm的复合钎料在5和8 min保温时间条件下,母材与钎料的冶金作用较好,钎料向弥散铜中毛细渗入较少,接头抗拉强度较高;采用厚度为0.3 mm的复合钎料,由于活性元素Ti百分含量减少使得钎料向弥散铜中毛细渗入作用减弱,在保温时间为15 min时,母材与钎料的冶金作用仍然较好,接头力学性能有明显的提高。

The vacuum brazing of Al2O3 dispersion-strengthen copper to copper T2 with filler Ag-Cu-Ti and BAg72Cu was studied. The influence of thickness of welding filler and holding time on the microstructure and tensile strength of the welded joint was studied. The results show that when the holding time is shorter, the metallurgical action is not good and the bond is not firm. When the holding time is longer, the filler seriously infiltrates into Al2O3 dispersion-strengthen copper, which can cause the appearance of holes in brazed joint and affect the quality of joint. Brazing with double layers Ag-Cu-Ti and one layer BAg72Cu composite filler, the performance of the welded joint is much better.