界面裂纹和印章材料性能对转印技术的影响

The effects of interface crack and material property of the stamp on transfer printing

转印技术是多种高性能柔性电子器件的制备过程中常用的技术,主要过程是通过印章将微纳米材料从源基体转印组装在目标基体上.转印过程中,印章、微纳米材料和基体组成三明治结构,包括印章/微纳米材料和微纳米材料/基体两个界面,两个界面竞争分层,直接决定转印的成败.基于有限元方法计算界面裂纹尖端能量释放率,探究两个界面竞争分层机制,确定界面裂纹及印章材料性能对转印的影响,提出利于转印的方法,为柔性电子器件的制备提供技术指导.

Transfer printing is a technique that uses a stamp to pick up micro-and nanomaterials from source substrates and then assemble them on a target substrate to fabricate the high performance flexible devices. In the process of transfer printing, a sandwich structure consists of a stamp, micro-and nanomaterials and a substrate, with stamp/substrate interface and micro-and nanomaterials/substrate interface. The two interfaces compete for producing delaraination, which determines whether the success of transfer printing or not. Based on calculating the energy release rate of interface crack by the finite element method, the mechanism of competing for producing delamination is investigated, then the effects of of the stamp on transfer printing are obtained, strateg guidance for the fabrication of high performance flexible el interracial crack and material property les to pro ectrics are mote transfer printing and provided finally.