带铝件的印制电路组件清洗技术研究

Research on Cleaning Technology of Printed Circuit Assembly Bonded With Aluminum Plate

针对带铝件的印制电路组件清洗后，铝件腐蚀的问题，探讨了各种清洗剂清洗的效果。结果表明：当清洗溶液φ（A）∶φ（B）为1∶（5～7），清洗剂体积分数6%～10%，温度50～55℃，时间10～15 min，采用KO2000清洗设备清洗，能同时解决铝件腐蚀问题及清洁度达到技术指标要求，清洁度≤1.55μg/cm2。适合带铝件的印制电路组件敷形涂覆前的清洗。

For the corrosion problem of aluminum plate in printed circuit assembly after cleaning, the effect of several cleaning agents were studied by experiments. The result indicates that the solution can not only denies the corrosion of aluminum piate, but also meets the requirement of cleanliness less≤1.55 μg/cm2,when KO2000 cleaning machine is used and the fol owing conditions are met：φ（A）∶φ（B）=1∶（5~7）, Cleaning agent volume fraction is greater than or equal to 6%~10%, temperature is 50~55℃, Cleaning time is 10~15 min. This solution fits cleaning of the printed circuit assembly bonded with aluminum plate before conformal coating.