摘要
LTCC技术作为高密度互连技术在电子产品中已得到广泛应用。而在微波高频电路中由于其印刷精度的限制一定程度上影响了电气性能。在LTCC上制作薄膜电路可以显著提高微带线精度及微波传输性能,同时提高微波产品集成密度,简化微组装工作步骤。通过工艺实验,分析和突破了LTCC-D工艺中的多项关键技术,形成了完整的工艺流程。该流程经样品和试生产验证达到了工程化应用水平。
LTCC technology is widely used in electric production due to its high density of interconnection. But the low precision of printing influences the performance of microwave circuit. The technology of thin film on LTCC may improve the precision of strip and optimize the performance of transmission. This technology will increase the integration of production, and predigest the process of assembly. The key technology of thin film on LTCC is analyzed based on experiment, and the whole manufacture flow is given. The capability of technical application is proved in the sample and test yield.
出处
《电子工艺技术》
2014年第2期91-93,124,共4页
Electronics Process Technology
关键词
薄膜
微波集成电路
LTCC
LTCC
Thin film
Microwave integrated circuit
