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浮动式剪应力微传感器的标定 被引量:2

Calibration of the Floating Element Shear Stress Micro-Sensor
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摘要 流体壁面剪应力微传感器的精确标定是进行流动测量的基础。分别采用自重加载、离心加载和风洞吹风三种不同方法,对基于电容检测原理的浮动单元剪应力微传感器进行标定与实验研究。对比了三种实验方法和标定的结果,分析了标定过程中的设备、传感器的加工及安装等误差的影响。研究结果表明,标定的传感器灵敏度为30 mV/Pa,三种标定方法的误差在2%以内,采用离心加载标定的误差最小;为进一步减小标定误差提供了改进方法。利用标定后的传感器,在风洞中对标准翼型的定点壁面剪应力值进行了测量,与仿真结果进行对比,二者能够较好吻合。 The accurate calibration of the flow wall shear stress micro-sensor is the basis of the flow measurement. Three different methods including the self gravity load, centrifugal load and wind tunnel experiment were carried out to calibrate and study the floating element micro-shear stress sensor based on the capacitance detection principle. Three experimental methods and cali- bration results were compared, and the errors caused by the equipment, sensor fabrication and mounting were analyzed. The results indicate that the calibration sensitivity of the sensor is 30 mV/Pa with the calibration error less than 2 %. The calibration error by the centrifugal load is minimal, reducing the calibration error. The wall shear stress of a standard airfoil was measured in the wind tunnel. And the measured result is in good agreement with the simulation result.
出处 《微纳电子技术》 CAS 北大核心 2014年第4期236-242,共7页 Micronanoelectronic Technology
基金 国家自然科学基金资助项目(50775188)
关键词 剪应力 微传感器 浮动单元 标定 误差 shear stress micro-sensor floating element calibration error
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参考文献13

  • 1BREUER K. MEMS sensors for aerodynamic applications-the good, the bad (and the ugly) [C] // Proceedings of the 38th Aerospace Sciences Conference. Reno, Nevada, USA, 2000: 1- 10.
  • 2NAUGHTON J W, SHEPPI.AK M. Modern developments in shear-stress measurement . Progress in Aerospace Sciences, 2002, 38 (6): 515-571).
  • 3MA B, REN J, DENG J, et al. Flexible thermal sensor array on PI film substrate for underwater applications [C] // Pro ceedings of the 23rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS). Hong Kong, China, 2010: 679- 682.
  • 4吕海峰,姜澄宇,邓进军,马炳和,苑伟政.用于壁面切应力测量的微传感器设计[J].机械工程学报,2010,46(24):54-60. 被引量:9
  • 5SCHMIDT M A, HOWE R T, SENTURIA S D, et al. De- sign and calibration of a microfabricated floating-element shear- stress sensor [J]. IEEE Transactions on Electron Devices, 1988, 35 (6): 750-757.
  • 6SCOTT M. The need for a shear stress calibration standard [C] // Proceedings of the 24th AIAA Aerodynamic Measure- ment Technology and Ground Testing Conference. Portland, USA, 2004:1-9.
  • 7HYMAN D, PAN T, RESHOTKO E, et al. Microfabricated shear stress sensors, part 2: testing and calihration . AIAA Journal, 1999, 37 (1): 73-78.
  • 8SCHETZ J A. Direct measurement of skin friction in complex flows [C] // Proceedings of the 48th AIAA Aerospace Sciences Meeting Including the New Horizons Forum and Aerospace Exposition. Orlando, Florida, USA, 2010: 1-28.
  • 9SCHEPLAK M, CATTAFESTA L, NISHIDA T, et al. MEMS shear stress sensors: promise and progress [C] // Proceedings of the 24th AIAA Aerodynamic Measurement Technology and Ground Testing Conference. Portland, USA, 2004:1 - 13.
  • 10LV H, JIANG C, XIANG Z, et al. Design of a micro floa ting element shear stress sensor . Flow Measurement and Instrumentation, 2013, 30: 66-74.

二级参考文献15

  • 1CHANDRASEKARAN V,CAIN A,NISHIDA T,et al.Dynamic calibration technique for thermal shear stress sensors with variable mean flow[C] // Proceedings of the 38th Aerospace Sciences Meeting & Exhibit,Reno,NV,January 10-13,2000.USA:AIAA,2000:1-9.
  • 2SCHMIDT M A,HOWE R T,SENTURIA S D et al.Design and calibration of a microfabricatedfloating-elem-ent shear-s tress sensor[J].IEEE Transactions on Electron Devices,1988,35(6):750-757.
  • 3PAN T,HYMAN D,MEHREGANY M,et al.Microfabricated shear stress sensors,part 1:Design and fabrication[J].AIAA Journal,1999,37(1):66-72.
  • 4HYMAN D,PAN T,RESHOTKO E,et al.Microfabricated shear stress sensors,part 2:Testing and calibration[J].AIAA Journal,1999,37(1):73-78.
  • 5PADMANABHAN A,SHEPLAK M,BREUER K S,et al.Micromachined sensors for static and dynamic shear-stress measurements in aerodynamic flows[J].TRANSDUCERS'97 1997 International Conference on Solid-state Sensors and Actuators,1997:137-140.
  • 6KOUROUMA H Y S.Design and analysis of an opticaldetection scheme for micromachined floating-element shear stress sensors[D].Florida:University of Florida,2002.
  • 7ARAI Y.Electronics and sensor study with the OKI SOI process[C] // proceedings of the Topical Workshop on Electronics for Particle Physics(TWEPP-07),Prague,Czech Republic,September,3-7,2007.Geneva:CERN,2007:57-63.
  • 8Ivo W Rangelow.Dry etching-based silicon micro-machining for MEMS[].Vacuum.2001
  • 9Paul A K,Rangelow I W.Fabrication of high aspect ratio structures using chlorine gas chopping technique[].Microelectronics Journal.1997
  • 10Frederilo S,Hiberx C,Fritschi P,et al.Silicon sacrificial dry etching(SSLDE) for free-standing RF MEMS architectures[].Journal of Microelectromechanical Systems.2003

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