Ag-Cu-In-Sn系低熔点钎料

Silver Base Brazing Alloys with Low Melting Point

研究一种新型银基钎料合金Ag—Cu—In—Sn,并提供其钎焊特性和钎接头的机械性能。此钎料具有较低蒸气压和熔化温度,钎焊接头具有较高的气密性,适用于电真空、半导体及微电子器件在真空或保护气氛中无钎剂钎焊。

A new silver base brazing alloy with low vapor pressure and low melting point was suggested, which constituent range was 57.6 wt% Ag22.4 wt%Cu-(20-x) wt% In-x wt% Sn ( 0≤x≤20) . And the solidus, liquidus, and brazing temperature range were 548～589℃, 558～626℃ and 600～650℃ respectively. The experimental results for brazing and leakage indicated that brazing joints used with this brazing alloy have higher gastightness and the leakage rate of brazing elements is<1×10^(-10) mmHg·L/s. Its melting temperature is decreased with the addition of tin. The addition of tin has the key effect on the brittleness of the alloy. The X-ray analysis shows that the constitution of the alloy consists of silver-rich solidus, copper-rich solidus and other 9 type inter-phases, such as CuSn and Cu_6Sn_6. With the increase in the content of Sn in the alloy, worse workability occures, This brazing alloy are suitable for brazing of electrovacuum, semiconductive, and microelectronic elements without flux at vacuum or protective atmosphere.