FT1500处理器中仿真驱动的DDR3封装设计

Simulation driven package design for FT1500 DDR3 interface

针对高性能微处理器封装中DDR3的信号完整性和电源完整性问题,提出了仿真驱动的封装设计方法:在设计之初通过前仿真制定准确的设计规则和目标,在设计过程中通过仿真指导设计优化,在设计完成后用后仿真验证设计结果。应用该方法设计了FT1500芯片封装,实测结果表明,该芯片的DDR3接口可以稳定工作在1 400Mbps。

To solve the problems of signal integrity and power integrity in DDR3 interface of FT1500 CPU, a simulation driven package design method is proposed. At the early stage, simulation is used to make accurate design rules and objectives. Then the package design is optimized repeatedly according to the simulation results. After the package design is completed, it is verified by the simulation. The design method is applied to FT1500 chip,whose DDR3 interface can work steadily with 1 400Mbps.