摘要
该文在对大量非接触IC卡进行抽样调查并进行机读功能失效分析的基础上,形成了一套完整的非接触IC卡机读功能失效分析流程,并对流程中所用各种检测工具和手段进行了简要介绍。按照此流程分析得出了非接触IC卡机读功能失效的失效模式,找出了失效原因,并就提升制造成品率、改善可靠性提出了相应的改进措施。
Based on the sampling survey and function failure analysis of plenty of contactleH IC card~,e complete procedure for the function failure analysis of contacfless IC card is presented in this paper.The testing methods and tool~ used In the procedure are introduced briefly.The failure modes of contactless IC card can be obtained from the procedure,and the cause of the failure can be found, Moreover,the improvement measures for improving the quality and reliability of the products ere proposed accordingly,
出处
《科技创新导报》
2014年第5期4-5,共2页
Science and Technology Innovation Herald
关键词
非接触IC卡
失效分析流程
失效模式
改进措施
Contactless IC card, Failure analysis procedure,Failure mode,Improvement meuure