银-锑合金电镀工艺研究

Study of electroplating technology of Ag-Sb alloy coating

研究了镀液组分及电镀工艺条件对银锑合金镀层锑含量和沉积速度的影响 ,研究结果表明 ,镀层锑含量随电流密度、氰化钾含量、酒石酸锑钾含量的增大而明显提高 ,随氢氧化钾含量的增加而明显降低 ,温度、酒石酸钾钠对镀层锑含量影响不大 ;镀层沉积速度由电流密度决定 ,镀液组分对其影响不大。根据上述研究结果及霍尔槽试验结果确定了镀液配方及电镀工艺参数 。

The effects of solution components for silver stibnic alloy electroplating and operative condition on stibnic content and depositing velocity of plating had been studied. The results indicate that, (1) stibnic content of plating is in direct proportion to current density,potassium cyanide content and antimony potassium tartrate content,(2) stibnic content of plating is in inverse proportion to potassium hydroxide content,(3)temperature and sodium potassium tartrate content is unaffected by stibnic content of plating,(4)depositing velocity of plating is determined by current density and unaffected by solution components. Solution components and operative condition were determined. The properties of plating had been examined overall.