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基于纳米技术的钼丝镀金实验研究

Research of the Experiment of Gold Plating on Molybdenum Wire Based on Nanotechnology
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摘要 以n-TiO2-film/Mo为基体,采用光催化化学镀法制备了Au/n-TiO2-film/Mo,并就还原剂用量以及光照时间对镀金液的稳定性以及镀金速率进行了研究。经试验得到合适的光照条件以及光催化镀金液配方,且制备的镀金钼丝表面覆盖的金层与基体具有良好的结合力。 : Au/n-TiO2-film/Mo were prepared by photocatalytic electroless plating using n-TiO2-film/Mo as substrates. The amount of reductant and the time of light stability and gilt rate of plating solution were studied. The right light conditions and photocatatytic plating solution are getted and the preparaed molybdenum wire gilded gold layer has good adhesion.
出处 《广东化工》 CAS 2014年第7期74-75,共2页 Guangdong Chemical Industry
关键词 光催化化学镀 镀金液稳定性 镀金速率 photocatalytic electroless plating the stability of gold plating bath plating rate
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  • 1费敬银,赵及成.难镀材料的电刷镀思路及部分实例[J].电刷镀技术,1993(4):1-3. 被引量:2
  • 2方景礼.印制板的表面终饰工艺系列讲座 第五讲 印制板化学镀镍/置换镀金新工艺[J].电镀与涂饰,2004,23(4):34-39. 被引量:9
  • 3迟兰洲,胡文成.硫氰化物化学镀金工艺的研究[J].电子科技大学学报,1995,24(5):555-559. 被引量:1
  • 4韩克平,方景礼.置换镀金工艺[J].材料保护,1997,30(1):24-27. 被引量:4
  • 5曾华梁.电镀手册[M].北京:机械工业出版社,1989.467-491.
  • 6高桥昭男,山本弘,中岛澄子,等.非电解镀金液及非电解镀金方法:中国,1 460 131A[P].2003-12-03.
  • 7Inoue Takashi,Ando Setsuo,Okudaira Hiroaki,et al.Stable NonCyanide Electroless Gold Plating Which Is Applicable to Manufacturing of Fine Pattern Printed Wiring Boards:45 th Electronic Components and Technology Conference[C].IEEE,New York,NY,USA,1995:1059-1067.
  • 8Yin X,Hong L,Chen B H.Role of a Pb^2+ Stabilizer in the Electroless Nickel Plating System:A Theoretical Exploration[J].J Phys Chem B,2004,108(30):10919-10929.
  • 9Ohtani Yutaka,Horiuchi Aiko,Yamaguchi Aritomo,et al.NonCyanide Electroless Gold Plating Using Polyphenols as Reducing Agents[J].J Electrechem Soc,2006,153(1):63-66.
  • 10Osaka T,Kato M,Sato J,et a1.Mechanism of Sofur Inclusion in Soft Gold Electrodeposited from the Thiosulfate-Sulfite Bath[J].J Electrochem Soc,2001,148(10):659-662.

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