耐高温环氧树脂胶黏剂的研究进展

Study on Epoxy Adhesive with Heat Resistance

耐高温胶黏剂广泛应用于航空航天、汽车、电子电器等领域,其中环氧树脂胶黏剂具有成本低廉、粘接强度高、综合性能好等优点,经常被作为耐高温胶黏剂的基体,但是固化后的环氧树脂存在耐热性不高等缺点,限制了它的广泛使用。为此,文章介绍了近年来通过无机填料、热塑性树脂、橡胶等方法改性环氧树脂制备耐高温环氧胶黏剂的研究成果,并对其发展前景进行展望。

The adhesive with heat resistance is widely utilized in many fields, such as in aerospace, auto industry and the electronics, one of which is the epoxy adhesive, which is often used as the matrix of the adhesive with heat resistance, for its cheap cost, high adhesive strength and excellent comprehensive performance. However, the thcrmo stability of the cured epoxy adhesive isn＇t so high, which restricts the application of the epoxy adhesive. Therefore, the domestic and foreign research development of preparing epoxy adhesive with high-temperature resistance, which is modified by inorganic filler, thermoplastic, rubber and so on, is reviewed. The trend of the epoxy adhesive with high-temperature resistance in the future is prospected at last.