摘要
提出了一种改进低温共烧陶瓷基板翘曲度的工艺方法。根据对实际工艺过程的观察及相关理论分析,发现烧结时承烧板的表面状态是影响基板翘曲度的关键因素之一,据此提出相应的改进方案,采用新型承烧板替代原有的承烧板进行烧结工艺,基板翘曲度得到了较大的改善,所烧结基板的起伏由原先的150~250μm,改善到80~110μm,较好地满足了后续微组装工艺的使用要求。
A method of improving substrate camber of low temperature co-fired ceramic is proposed. On the basis of practical product process and theory analysis, the state of setter surface is found to be a key factor affecting substrate camber. In co-fired processing, using a new setter instead of an old one can obviously improve substrates camber. The camber of substrate is decreased from 150-250μm to 80-110 μm, and this major improvement assures that the substrate can better satisfy the needs of next micro-assembly process.
出处
《固体电子学研究与进展》
CAS
CSCD
北大核心
2014年第2期192-196,共5页
Research & Progress of SSE
关键词
低温共烧陶瓷
翘曲度
工艺研究
low temperature co-fired ceramic (LTCC)
camber
process research