一种基于聚合物材料的延迟线阵列与热光开关集成器件的设计

Design of an Integrated Device of Delay Line Array and Thermal Optical Switch Based on Polymeric Materials

设计了一种基于聚合物材料的延迟线阵列与热光开关的集成器件.利用Rsoft软件设计并模拟了多模干涉热光开关的性能,可实现输出光场强度随电极加热温度变化.设计了螺旋结构的延迟线阵列,利用BPM软件对螺旋结构波导进行数值模拟,综合考虑器件尺寸和损耗参量设计出螺旋结构的弯曲半径.将延迟线阵列结构与热光开关进行集成,能够实现热光控制的聚合物延迟线阵列,该器件可实现的最大延迟时间为399.4ps,延迟间隔为9.2ps.以SiO2为下包层,SU-8紫外固化光刻胶为波导芯层,聚甲基丙烯酸甲脂为上包层,采用旋涂、光刻、湿法腐蚀等工艺制备了1×4延迟线阵列与MMI热光开关的集成器件,测试得到了延迟线阵列的近红外输出光斑,插入损耗为15~19dB.

An integrated device was designed which was composed of thermo-optic switch and delay line array.Rsoft software was used to optimize the parameters of digital multi-mode interference thermo-optic switch,and the varied output signal intensity can be achieved with changing the temperature of an electrode.Then a delay line with a helical structure was designed.Spiral waveguide structure was simulated by BPM software.Considering the size of the device and the loss parameter,a reasonable bend radius of the spiral structure was designed.The integrated delay line array structure with the thermooptic switch has a maximum delay time of 399.4ps and the corresponding delay interval is 9.2ps.The device has three layers,which are fabricated by using SiO2as lower cladding layer,SU-8photoresist as core layer and polymethylmethacrylate as upper cladding layer.By spin coating,lithography and wet etching,an integrated device with 1×4 MMI thermo-optic switch and delay line array was fabricated, and near-infrared field patterns of the delay line array was tested with insertion loss of 15~19dB.