摘要
CVD金刚石膜因其极高的强度和耐磨特性在微机电系统(MEMS)领域具有极好的应用前景,然而其极高的硬度和化学惰性又使其很难被加工成型,这极大地限制了CVD金刚石膜在MEMS领域的应用。本文主要介绍了近年来干法刻蚀图形化CVD金刚石膜的研究进展,系统地分析了激光刻蚀,等离子体刻蚀,等离子体辅助固体刻蚀的原理及其各自优缺点,着重论述了国内外采用等离子体刻蚀CVD金刚石膜的研究现状。
CVD diamond film has great application prospect in micro-electro mechanical systems （MEMS） because of its excellent intensity and abrasion resistant properties, but its practical application in MEMS is limited for its high hardness and chemically stable which makes it difficult to fabricate. In this paper, the latest developments of dry etching graphically progress of CVD diamond film is introduced, and the principles of the laser etching, plasma etching, plasma-assisted etching of solid and their respective advantages and disadvantages are systematically analyzed. Great attention is focused on the plasma etching of CVD diamond film in domestic and international.
出处
《金刚石与磨料磨具工程》
CAS
2014年第2期29-35,共7页
Diamond & Abrasives Engineering
基金
国家自然科学基金项目(11175137)
