中空玻璃微球改性环氧树脂复合材料的性能研究

Thermal,Morphological and Dielectric Properties of Epoxy Resin Composites reinforced by Hollow Glass Microspheres

通过在环氧树脂E51基体中添加中空玻璃微球（Hollow glass microspheres，HGM）制备出低介电环氧树脂／HGM复合材料。通过扫描电子显微镜（Scanning Electron Microscope，SEM）分析HGM在环氧树脂中的分散情况并研究了HGM及不同含量HGM对环氧树脂复合材料的介电性能、热稳定性、力学强度及吸水率的影响。结果表明：HGM均匀地分散于环氧树脂中；复合材料的介电常数随着HGM含量的增加呈明显的下降趋势，当HGM为33．3％时，材料的介电常数降至了2．65；HGM对环氧树脂的热稳定性影响不大，初始热分解温度最大提高了10℃，玻璃化转变温度下降2-3 ℃；触变剂SiO2的加入有效减少了材料的力学强度的损失；在25℃下，复合材料的吸水率明显降低，但在100℃的沸水中，当HGM质量分数大于10％时，吸水率随着HGM添加量的增加而有所上升。

The low dielectric epoxy resin/hollow glass microspheres composites were prepared by adding hol-low glass microspheres to the basal body of epoxy resin E51. The section morphology of the epoxy resin/HGM composites was studied by scanning electron microscope （SEM） and the dielectric properties, thermalstability, mechanical strength and water absorption were also investigated in detail. The results indicate thatHGM dispersed uniformly in the epoxy matrix and with the increasing content of HGM, the Dk was reducedto 2.65 at the HGM content of 33.3%. The T5 value was improved by 10 ℃ and Tg values were reducedslightly （2 -3 ℃ ）. The thixotropic agent SiO2 made the HGM mass fraction disperse uniformly and reducedthe mechanical strength loss. At 25 ℃, the composites performed lower water absorption than pure resins.But at 100 ℃ in the boiling water, water absorption was stronger than E51 when HGM content exceeded10% and increased gradually.