再流区工艺参数对焊接可靠性的影响

Impact of Reflow Parameter on Solder Joint Reliability

影响表面组装焊接可靠性的因素很多 ,从钎焊机理入手 ,经过金相分析就再流区工艺参数对焊点微观结构的影响进行了研究 。

There are many facts which affect the SMT reliability.Research impact of reflow section process parameters on solder joint microstructurce by metallographic analysis and solder pull strength on solder theory,and put forward the principles controlling reflow process.