摘要
简要阐述免清洗焊接回流温度曲线的基本构成 ,设定温度曲线所需工具以及设定方法。结合实际经验 。
The component of No-cleaning reflow profile are explained.Tools required and operating steps are also introduced.Relating with experience,several soldered defects concerning reflow profile and ways how to get rid of defects are summarized.
出处
《电子工艺技术》
2001年第2期64-66,共3页
Electronics Process Technology
