摘要
In recent years the high efficiency of small and light weight electronic devices has been progressing and the multilayer printed wiring board in connection with this have been progressing as well, becoming many pins or a narrow pitch. The build-up board, which makes high-density and narrow pitch possible, is basking in the limelight of this progression trend. (Fig 1) Now, many methods of construction of these build-up boards is advocat-
出处
《印制电路信息》
2001年第2期26-30,共5页
Printed Circuit Information
