高Tg多层印制板孔壁微裂纹的改善

Improvement of high Tg multilayer printed board through-hole plating micro-crack

在印制板的化学沉铜过程中,用于中Tg基板的工艺流程和配方,在加工高Tg基板时会出现非钻孔腻污等常见现象引起的孔壁微裂纹。实验表明,在不改变溶液体系的情况下,通过改善化学沉铜工艺流程和优化配方两种方法,可以极大的改善高Tg印制板的孔壁微裂纹情况,其中化学沉铜槽的配方对孔壁微裂纹起到决定性的影响。

During electroless copper plating processes, using process and chemical composition of medium Tg base material will result in PTH micro-crack in the production of high Tg, while the reason is not on resin smear. Based on the experiment, by not changing the solution system, the through-hole plating micro-crack problem of high TG PCB can be largely optimized by improving PTH process and electroless copper plating solution ratio, while the electroless copper plating solution ratio is the decisive factor for through-hole plating micro-crack.