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单晶硅表面沉积Ni-Co-P镀层的显微结构和性能 被引量:4

Microstructures and Properties of Electroless Ni-Co-P Coatings on Si(100) Substrate
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摘要 采用化学镀工艺在P型(100)单晶硅表面制备了2种Ni—Co—P镀层,对比分析其显微结构和性能。结果表明:Ni48C046P6镀层为非晶和纳米晶混合结构,表面均匀分布着直径0.2~3.5gm的球状团簇。而Ni22Co74P4镀层为单相密排六方结构,含有强烈的(0002)晶面择优取向,表面由纳米级梭状团簇和微米级苞状团簇混合而成。在3.5%NaCl溶液中,2种镀层均表现出活化一钝化一过钝化的腐蚀行为,其中Ni48C046P6镀层的耐蚀性能较好。而在1.0%H2SO4溶液中,2种镀层的耐蚀性能均大幅下降。与Ni48C046P。镀层相比,Ni22C074P4镀层的室温电阻率略有降低,饱和磁化强度和矫顽力显著升高。 Two types of Ni-Co-P coatings were synthesized by electroless deposition on p-type Si (100) substrates. Microstructures and properties of the coatings were studied and compared. A mixture of amorphous and nanocrystal structures was found in Ni48Co46P6 coatings, while Ni22Co74P4 coatings contained a nanocrystalline hexagonal closed packed phase with a strong (0002) texture. Surfaces of both coatings were composed of clusters. In Ni4Co46P6 coatings, the clusters were 0.2 - 3.5 μm nodules that distributed uniformly whereas in Ni22Co74P4 coatings there were nano-sized shuttle clusters mixed with micro-sized bud clusters. Both coatings exhibited activation-passivation-transpassivation processes in 3.5% NaCl solution, and Ni48Co46P6 coatings showed a better corrosion resistance However, corrosion resistance of both Ni-Co-P coatings was decreased remarkably in 1.0% H2SO4 solution. Compared with Ni48Co46P6 coatings, Ni22Co74P4 coatings showed a much improved saturation magnetization and coercivity with a slightly decreased electrical conductivity.
机构地区 中国矿业大学
出处 《稀有金属材料与工程》 SCIE EI CAS CSCD 北大核心 2014年第3期722-726,共5页 Rare Metal Materials and Engineering
基金 国家自然科学基金(61107080) 中央高校基本科研业务费(2010QNA08)
关键词 Ni—Co—P合金 化学镀 显微结构 腐蚀行为 电磁性能中图法 Ni-Co-P alloy electroless microstructure corrosion behavior electric and magnetic property
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参考文献15

  • 1Iwasaki S, Ouchi K. IEEE Transactions on Magnetics[J]. 1978, 14:849.
  • 2Judge J S, Morrison J R, Speliotis D E. Journal of Applied Phvsics[Jl, 1965, 36:948.
  • 3Narayanan T S N, Selvakumar S, Stephen A. Surface & Coatings Technology[J]. 2003, 172:298.
  • 4杨海燕,卫英慧,侯利锋,耿冰霜,许并社.化学镀Ni-Co-P工艺与性能研究[J].稀有金属材料与工程,2008,37(11):1982-1986. 被引量:6
  • 5Gao Y, Huang L, Zheng Z Jet al. Applied Surface Science[J]. 2007, 253:9470.
  • 6Huang Y, Shi K, Liao Z Jet al. Materials Letters[J]. 2007, 61: 1742.
  • 7Kumar A, Kumar M, Kumar D. Microelectronic Engineering[J]. 2010, 87:387.
  • 8Pang J F, Li Q, Wang Wet al. Surface & Coatings Technology[J]. 2011,205:4237.
  • 9Kumar A, Singh A, Kumar Met al. Journal of Materials Science[J]. 2011, 22:1495.
  • 10Murthy S K, Vemagiri J K, Gunasekaran R A et al. Journal of the Electrochemical Society[J]. 2004, 151 : C 1.

二级参考文献13

  • 1杨海燕,卫英慧,毕虎才,侯利锋,郭耀文,余春燕,许并社.压铸镁合金AZ91D手机内构件的Ni-P化学镀[J].稀有金属材料与工程,2005,34(12):1978-1981. 被引量:4
  • 2Li Ning(李宁).Application Technology Electroless Plating(化学镀应用技术)[M].Beijing: Chemistry Industry Press, 2003:362
  • 3Bi X F et al. Mater Sci Eng [J], 2003, 344:74
  • 4Park D Yet al. Electrochim Acta[J], 2002, 47:2893
  • 5Murthy S K et al. JElectrochem Soc[J], 2004, 151(1): C1
  • 6Homma T et al. J Electrochem Soc[J], 2000, 147(11): 4138
  • 7Fenineche N et al. Surf Coat Technol[J], 1997, 88:264
  • 8Younan M Met al. J Appl Electrochem[J], 2002, 32:439
  • 9Lee D N, Hur K H. Scripta Mater[J], 1999, 40(12): 1333
  • 10Ma E M, Luo S F, Li P X. Thin Solid Films[J], 1998, 166:273

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