摘要
装配是产品生命周期的重要环节,电子行业结构复杂产品的装配过程费时费力。为了提高复杂电子产品装配的质量和效率,在此分析了雷达等复杂电子产品三维装配工艺设计的特点和现状,提出了一种基于MBD的三维模型装配工艺设计、仿真与应用方法,并建立了三维装配工艺设计流程和系统体系结构,对三维装配工艺设计的关键技术进行了分析,为三维装配工艺的实施提供了重要技术支持,对于发展数字化装配工艺技术的制造行业具有借鉴意义。
Assembly is an important part in the lifecycle of products. The assembly process of complex electronic productswastes time and energy. To improve assembly quality and efficiency of complex electronic products,the assembly process charac-teristics and status of radar and other complex electronic products were analyzed,and a method for three-dimensional model as-sembly process design,simulation and application based on MBD was proposed. A new three-dimensional assembly process plan-ning system was established based on the application requirement. The key technologies involved in the system are analyzed inthis paper. This method provides an important support for three-dimensional process planning technology application. It ismeaningful for the manufacturing industry which attempts to develop the digitalization assembly technology.
出处
《现代电子技术》
2014年第6期81-82,87,共3页
Modern Electronics Technique
关键词
复杂电子产品
三维装配工艺技术
MBD
可视化
complex electronic product
three-dimensional assembly process technology
model-based definition
visualiza-tion
