摘要
给出了三维技术的定义,并给众多的三维技术一个明确的分类,包括三维封装(3D-P)、三维晶圆级封装(3DWLP)、三维片上系统(3D-SoC)、三维堆叠芯片(3D-SIC)、三维芯片(3D-IC)。分析了比较有应用前景的两种技术,即三维片上系统和三维堆叠芯片和它们的TSV技术蓝图。给出了三维集成电路存在的一些问题,包括技术问题、测试问题、散热问题、互连线问题和CAD工具问题,并指出了未来的研究方向。
The definition of 3D technologies is given in this paper. A clear classification of variety 3D technologies is pro-posed,in which there are 3D packaging,3D wafer-level packaging,3D system-on-chip,3D stacked-integrated chip and 3D in-tegrated chip. Two technologies （3D system-on-chip and 3D stacked-integrated chip） with application prospect and their TSV technical roadmap are analyzed and compared. 3D integrated circuit＇s some problems in the aspects of technology,testing,heat dissipation,interconnection line and CAD tool are proposed and analyzed. Its research prospect is pointed out.
出处
《现代电子技术》
2014年第6期104-107,共4页
Modern Electronics Technique
基金
国家自然科学基金广东省联合基金:数学社区无线网络信息融合安全理论及关键技术研究(U1135002)
