摘要
The hot deformation behavior of IN706 has been investigated by means of hot compression tests in the temperature range of 900-1150℃ and strain rate range of 0.001-1 s^-1. The constitutive equation was developed on the basis of experimental data. Power dissipation efficiency (η) and instability parameter (4) maps were evaluated using the principles of the dynamic material model. Furthermore, the EBSD microstructure analysis was performed for validation, revealing that η was closely associated with the mechanism of dynamic recrystallization (DRX). Microstructure transition map was composed of contour plots of η, 4, and DRX. The DRX domain zones and instable zones were identified in the processing map and were classified based on η. In a view of microstructure refinement and workability improvement, the optimum processing should be selected in the temperature range of 970-1025 ~C and the strain rate range of 0.08-0.01 s^-1.
The hot deformation behavior of IN706 has been investigated by means of hot compression tests in the temperature range of 900-1150℃ and strain rate range of 0.001-1 s^-1. The constitutive equation was developed on the basis of experimental data. Power dissipation efficiency (η) and instability parameter (4) maps were evaluated using the principles of the dynamic material model. Furthermore, the EBSD microstructure analysis was performed for validation, revealing that η was closely associated with the mechanism of dynamic recrystallization (DRX). Microstructure transition map was composed of contour plots of η, 4, and DRX. The DRX domain zones and instable zones were identified in the processing map and were classified based on η. In a view of microstructure refinement and workability improvement, the optimum processing should be selected in the temperature range of 970-1025 ~C and the strain rate range of 0.08-0.01 s^-1.
基金
financially supported by the High Technology Research and Development Program of China (No.SS2012AA030801)
the National Basic Research Development Program of China (No.2010CB631203)
the Common Technical Research Aircraft Key Component Forming (No.2012ZX04010-081)