不同基底上Au纳米粒子的2D组装与AFM表征

2D assembly of Au nanoparticles on different substrates and AFM characterization

从Au纳米粒子出发,利用竖直浸渍提拉法(dip-coating)成功将Au纳米粒子负载于基底(云母片/单晶硅片),并以3-氨丙基三甲氧基硅烷(APTMS)对单晶硅片进行改性,得到具有密度分布不同的Au纳米粒子two dimensional(2D)组装结构,制备方法简单易行。利用原子力显微镜(AFM)表征了不同制备条件下Au纳米粒子在基底表面的分布状态,结果表明,Au纳米粒子溶胶和偶联剂APTMS的浓度以及浸渍时间对Au纳米粒子在单晶硅片表面的密度分布起到决定性作用。

Through the dip-coating mode, Au nanoparticles were deposited on the mica and 3-aminopropyltrimethoxysilane modified silicon wafer, forming Au nanopartilces 2D-assembled structures with different density distributions. The distribution of Au nanoparticles on the substrates was characterized by atomic force microscopy （AFM） and the results showed that the concentrations of the Au nanoparticles sol and APTMS as well as the dipping time were the crucial factors to control the density distribution of Au nanoparticles on the silicon wafer.