蓝宝石衬底双面研磨亚表面损伤双片式角度抛光法检测

Double-substrate angle polishing to detect the damage on sapphire substrate body after double-grinding

针对传统角度抛光法检测的不足,提出将双片式角度抛光法用于蓝宝石衬底双面研磨亚表面损伤层深度的检测。双片式角度抛光法采用双晶片重合黏结的实验晶片组测量抛光斜面腐蚀裂纹,避免了传统角度抛光法因抛光斜面和原晶片平面分界边缘难以辨别而造成的测量误差;使用数显测长仪对实验晶片组抛光斜面加工轮廓进行测量,测量结果代入相应计算公式得出准确的斜面倾角,消除角度取值不准确带来的方法误差,提高了测量精度。经检测得到,单晶面抛光斜面平均裂纹宽度约为175μm、平均斜面倾角为4.91°,双面研磨单晶面亚表面损伤层深度约为15μm,双晶面亚表面损伤层深度约为30μm。双面研磨工艺参数:研磨液采用320#碳化硼磨粒煤油溶液,研磨初始压力为30g/cm2,研磨终止压力为110g/cm2,研磨盘转速为13r/min。

Present a new way to detect the damage on sapphire substrate after grinding to avoid the defect of traditional way. The way makes a test-specimen which is made of two adherent substructs to test the deep of damage on inclined plane after polishing, avoid the mistake of polished inclined plane and the edge of substrate plane, this mistake can bring error in investing, the size of test-specimen can be obtained with digital length measurement, so calculate the accurate results with these number and dispel the method error drag-in during testing, the accuracy of measurement is improved to nanoscale. In the experiment, the damage of pol- ishing cant of single substrate is 175μm, bevel angle is 4.91°, from these, obtain that the accurate depth of damage in one of the substrates is 15μm after two-sided lapping and the total depth of the double is 30μm. The technological parameter：320# boron carbide abrasive,the initial pressure is 30g/cm2 ,end pressure is 110g/cm2 ,rotate speed of polishing disc is 13r/min.