期刊文献+

FDTD based transition time dependent crosstalk analysis for coupled RLC interconnects 被引量:2

FDTD based transition time dependent crosstalk analysis for coupled RLC interconnects
原文传递
导出
摘要 The performance of high density chips operating in the GHz range is mostly affected by on-chip interconnects. The interconnect delay depends on many factors, a few of them are inputs toggling patterns, line & coupling parasitics, input rise/fall time and source/load characteristics. The transition time of the input is of prime importance in high speed circuits. This paper addresses the FDTD based analysis of transition time effects on functional and dynamic crosstalk. The analysis is carried out for equal and unequal transition times of coupled inputs. The analysis of the effects of unequal rise time is equally important because practically, it is quite common to have mismatching in the rise time of the signals transmitting through different length wires. To demonstrate the effects, two distributed RLC lines coupled inductively and capacitively are taken into consideration. The FDTD technique is used because it gives accurate results and carries time domain analysis of coupled lines. The number of lumps in SPICE simulations is considered the same as those of spatial segments. To validate the FDTD computed results, SPICE simulations are run and results are compared. A good agreement of the computed results has been observed with respect to SPICE simulated results. An average error of less than 3.2% is observed in the computation of the performance parameters using the proposed method. The performance of high density chips operating in the GHz range is mostly affected by on-chip interconnects. The interconnect delay depends on many factors, a few of them are inputs toggling patterns, line & coupling parasitics, input rise/fall time and source/load characteristics. The transition time of the input is of prime importance in high speed circuits. This paper addresses the FDTD based analysis of transition time effects on functional and dynamic crosstalk. The analysis is carried out for equal and unequal transition times of coupled inputs. The analysis of the effects of unequal rise time is equally important because practically, it is quite common to have mismatching in the rise time of the signals transmitting through different length wires. To demonstrate the effects, two distributed RLC lines coupled inductively and capacitively are taken into consideration. The FDTD technique is used because it gives accurate results and carries time domain analysis of coupled lines. The number of lumps in SPICE simulations is considered the same as those of spatial segments. To validate the FDTD computed results, SPICE simulations are run and results are compared. A good agreement of the computed results has been observed with respect to SPICE simulated results. An average error of less than 3.2% is observed in the computation of the performance parameters using the proposed method.
出处 《Journal of Semiconductors》 EI CAS CSCD 2014年第5期69-73,共5页 半导体学报(英文版)
关键词 FDTD transition time crosstalk noise DELAY coupled interconnects FDTD transition time crosstalk noise delay coupled interconnects
  • 相关文献

参考文献18

  • 1Rabaey J M. Digital integrated circuits: a design perspective. Prentice-Hall, Englewood Cliffs, N.J., 1996.
  • 2Bakoglu H B. Circuits, interconnections and packaging for VLS1. Reading, MA: Addison-Wesley, 1990.
  • 3Elgamel M A, Bayoumi M A. Interconnect noise analysis and optimization in deep submicron technology. IEEE Circuits Syst Mag, 2003, Fourth Quarter: 6.
  • 4Agarwal K, Sylvester D, Blaauw D. Modeling and analysis of crosstalk noise is coupled RLC interconnects. IEEE Trans Computer-Aided Design of Integrated Circuits and Systems, 2006, 25(5): 892.
  • 5Kaushik B K, Sarkar S, Agarwal R P, et al. Effect of line resis- tance and driver width on crosstalk in coupled VLSI intercon- nects. Microelectronics International, 2007, 24(3): 42.
  • 6Roy A, Mohmoud N, Chowdhury M H. Effects of coupling ca- pacitance and inductance on delay uncertainty and clock skew. Design Automation Conf, 2007:184.
  • 7Kang S M, Leblebici Y. CMOS digital integrated circuits-- analysis and design. TMH, New York, 2003.
  • 8Roy A, Xu J, Chowdhury M H. Analysis of the impacts of signal slew and skew on the behavior of coupled RLC interconnects for different switching patterns. IEEE Trans VLSI Syst, 2010, 18(2): 338.
  • 9Kaushik B K, Sarkar S, Agarwal R P, et al. Crosstalk analysis and repeater insertion in crosstalk aware coupled VLSI interconnects. Microelectronics International, 2006, 23(3): 55.
  • 10Sharma D K, Kaushik B K, Sharma R K. Effect of equal and mismatched signal transition time on power dissipation in global VLSI interconnects. International Journal of VLSI Design and Communication Systems, 2012, 3(4): 111.

同被引文献8

引证文献2

二级引证文献2

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部