摘要
开发了一种通盲孔匹配的电镀铜添加剂CPP108,此添加剂既可以用于板面电镀又能够用于图形电镀.研究了该体系的盲孔性能和通孔性能,并对其可靠性进行了测试.该体系具有高的通孔及盲孔贯孔能力,添加剂稳定可靠,易于控制.经过长期试验线的批量测试,于2010年5月成功用于上海美维电子有限公司电镀生产线.
It is introduced one new copper plating additive-CPP108, which can be used for both panel plating and pattern plating. The performance and reliability were also investigated for both blind vias and through holes. The results show that our system has the advantage of high TP value for both blind vias and through holes. And the additive is stable and easy to control. After a large number of tests and long time running in trial-run line, it has been successfully used in mass production in Shanghai Meadville Electrics Co. , Ltd. since May 2010.
出处
《复旦学报（自然科学版）》
CAS
CSCD
北大核心
2014年第2期198-204,209,共8页
Journal of Fudan University：Natural Science
关键词
电镀铜
盲孔
添加剂
可靠性
copper plating
blind via
additive
responsibility
