摘要
设计了一种基于超材料的双频吸波器,由介质基板和上下两层金属组成。介质基板采用厚度为0.3 mm的高频PCB(印刷电路板):Rogers RT5880(相对介电常数εr=2.2,损耗角正切tanδ=0.0009),金属层厚度0.017 mm,材质铜(电导率σ=5.8×107s/m)。顶层金属为超材料单元胞,由开口金属方环结合十字缝隙组成,底层为全覆盖金属底板。利用HFSS软件进行了电磁仿真,在超材料结构表面施加垂直入射正弦平面波激励。仿真结果表明,其对垂直入射的6.2GHz、9.9 GHz的平面电磁波吸收率分别为80.07%和98.27%。该吸波器可作为基于PCB芯片间无线互连系统的吸波层,防止电磁辐射。
An electromagnetic wave dual band absorber based on the metamaterial technology is designed in this research, which consists of a dielectric substrate and the two layers of metals. High - frequency PCB : Rogers RT5880 ( relative permittivity 6r = 2.2, loss tangent tarns = 0. 0009 ) is used as the dielectric substrate with thickness of 0.3ram. The metal layer is built with copper ( conductivity o" = 5.8 x 107s/m) whose thickness is 0.017mm. The upper metal layer is built with split rectangular rings with a gap at its two sides while the lower layer is a flat microstrip line. HFSS software, a powerful electromagnetic simulation tool was employed to virtually construct and simulate the proposed absorber structure. A vertical incident sinusoida] plane wave was impinged on the surface of the metamaterial structure. It is shown that the absorptivity can be 80.07% and 98.27% for the case of the vertical incidence at 6.2 GHz and 9.9 GHz respectively. The proposed absorber can be potentially used in the system of the PCB-based wireless inter - chip connections as an absorbing layer to prevent the electromagnetic radiation.
出处
《北京信息科技大学学报(自然科学版)》
2014年第2期8-12,共5页
Journal of Beijing Information Science and Technology University
基金
国家自然科学基金面上项目(61171039)
关键词
超材料
双频吸波器
电磁谐振
吸波材料
芯片间无线互连
电磁辐射
metamaterial
dual band absorber
electromagnetic resonant
absorbing materials
wireless inter-chip connection
electromagnetic radiation