芯片间无线互连通信系统结构设计

Design of wireless inter-chip communication systems by using an innovative PCB structure

在分析了射频互连、交流耦合互连、三维互连、光互连以及基于片上天线无线互连等系统的优点、缺点基础上,阐述了基于印刷电路板(Printed Circuit Board,PCB)实现芯片间无线互连的新结构:以芯片管脚作为收发天线,利用PCB介质形成无线通信信道。与其它互连方式相比,在减少PCB层数、减少对外部环境的电磁污染、实现无线多信道以及兼容互补金属氧化物半导体(Complementary Metal Oxide Semiconductor,CMOS)工艺等方面具有明显优势。设计了工作于60GHz的4个单极子天线阵列,代表2个芯片的4个管脚,仿真结果表明发射天线的S11在60 GHz时达到-19 dB,在4080 GHz之间均小于-10 dB,相对带宽约为50%,满足超宽带无线通信要求。

On the basis of analyzing the advantages and disadvantages of radio frequency （RF） interconnection, alternating current （ AC ） coupling interconnection, three dimensional （ 3D ） interconnection, optical interconnection and wireless interconnection by on-chip antennas, an innovative PCB structure for wireless inter-chip interconnections is presented, in which pins of chips are employed as on-chip transceiver antennas and the dielectric-filled PCB system is formed as wireless communication channels. In comparison to other interconnection methods, the proposed new structure has the distinct advantages in terms of reducing number of PCB layers, minimizing electromagnetic radiation and pollution to external environments, realizing wireless muhichannels＇ compatibility with CMOS fabrication process. In this paper, an antenna array composed of four monopoles at 60GHz is designed. Herein, the four monopoles denote the four pins of two chips. It is shown from HFSS simulation that the magnitude of S11 for the transmitting antenna achieves - 19dB at 60GHz and is less than - 10dB in the frequency band of 40 -80GHz. The relative bandwidth is about 50%, which fully satisfies the requirement of Ultra Wide Band （UWB） wireless communication.