压力条件下固-液复合法制备铜/锌复合材料的研究

Research on Fabrication of Cu/Zn Compound Materials by Solid-Liquid Bonding Method Under the Condition of Pressure

采用压力条件下固-液复合法,在不同的锌液浇注温度下制备了铜/锌复合材料,并对其界面结合质量、组织成分和硬度等进行分析研究。结果表明:在铜板预热温度440℃,锌液浇注温度420℃时,可以获得厚度约为8μm、冶金结合良好的复合界面,此时界面层抗拉强度大于40.86MPa,超过铸态锌基体的抗拉强度;随着锌液浇注温度的升高,界面层厚度增加,抗拉强度降低,界面层生成的金属间化合物(CuZn)增多;界面层硬度显著高于基体硬度。

Cu/Zn compound materials were fabricated by solid-liquid bonding of pressure method under different pouring temperature conditions,and then the bonding quality,microstructures,tensile strength and hardness of Cu/Zn interfaces were studied.The research results show that the well-bonded metallurgical bonding interface with a transition layer of about 8 μm in thickness can be obtained as the Cu plate is preheated at 440 ℃ and the pouring temperature is 420 ℃,and the tensile strength of interface layer is greater than 40.86 MPa,which is higher than the tensile strength of as-cast zinc base; with the increase of pouring temperature,interface layer thickness increases,the tensile strength decreases,intermetallic compounds （CuZn） in interface layer increases; the hardness of interface layer is higher than the hardness of matrixs significantly.