半导体制冷的圆柱体三维传热模型及仿真

Simulation and Three-Dimensional Temperature Field for Cylinder Cooled by Semiconductor

考虑热源和外部环境对圆柱体三维传热模型和温度场分布的影响,建立了基于半导体制冷的圆柱体三维传热模型,利用变量分离法和拉普拉斯变换法,导出了其三维温度场的封闭解析解.通过数值计算和编程仿真,给出相应的仿真结果,分析了半导体制冷片的位置变化对圆柱体三维温度场的影响特性.为进一步分析圆柱体三维温度场及其应用提供理论依据.

The three-dimensional heat transfer model of a cylinder is established based on the semiconductor refrigeration,in which the influences of the heat source and the external environment on the heat transfer model and the temperature field are considered.By using the variables separation and Laplace transform method, the closed analytical solution of three-dimensional temperature field is derived.The corresponding simulation results are obtained by using the numerical calculation and simulation.The characteristics of temperature field are analyzed.It provides a theoretical basis for the further analysis of three-dimensional temperature field of cylinder and its application.