摘要
通过对预烘、光刻胶旋涂、软烘焙、对准曝光、后烘、显影、坚膜的光刻工艺过程分析,主要介绍了光刻工艺中容易出现的问题及解决方法,并通过实验和分析得出了可靠的技术方案.
The process of the photolithography were introduced in this paper,including pre-baking,the photoresist coating,soft baking,alignment and exposure,post-exposure baking,development,hard baking. Then we mainly discussed the problems in the photolithography process and the solutions of these problems. We did large number of experiments,and the results were carefully analyzed. Finally,reliable and stable solutions were provided via analyzis and experiments.
出处
《上海师范大学学报（自然科学版）》
2014年第2期132-136,共5页
Journal of Shanghai Normal University(Natural Sciences)
基金
973计划预研专项(2012CB326402)
上海市科委创新项目(13ZZ108)
关键词
光刻
光刻工艺
光刻胶
photolithography
photolithography technique
photoresist
