高密度SIP设计可靠性研究

The Study of High-density SIP Design's Reliability

随着SIP设计技术的不断发展,SIP设计的系统也日趋复杂。高密度SIP设计是SIP设计师必须解决的设计挑战,也是需要掌握的重要技术。对于SIP设计而言,系统的热耗散问题和信号完整性问题都至关紧要,是设计成败的关键。设计SIP时,必须事先仿真由系统功耗引起的温度分布状况和信号完整性情况,分析其对系统各方面的影响,并研究相应的处理方法。结合实际工程,利用Cadence16.6 SiP软件设计了一款高密度SIP芯片,对设计流程和关键技术做了介绍,较好地实现了高效可靠的高密度SIP设计。

Along with the developing of SIP designing technology, the SIP designed system is becoming more and more complicated. SIP stylists are need to resolve the challenge of high-density SIP item, and required to command the important technology. To the design of SIP, the critical points are heat-dissipation and signal-integrality, which are the keys for a successful design. At the beginning of design, simulations for heat-distribution and signal-integrality must be done to analyze its affection to the system for a method to dealing with. The paper designed a High-density SIP chip using the SiP software cadence 16.6, introduced the design-flow and the key-technology, and preferably actualized valid and reliable high-density SIP design.